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Inspection Equipment×アイビット - List of Manufacturers, Suppliers, Companies and Products

Inspection Equipment Product List

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A must-see for companies that don't want to fail in selecting X-ray equipment! *Technical materials available.

A must-see for companies that don't want to fail in selecting X-ray equipment! *Technical materials available.

Did you find the "resolution" you imagined based on the numbers in the catalog? A thorough explanation of the key points needed for selecting X-ray equipment! *Real machine tests are also being accepted.

It's dangerous to trust only the catalog! Did you know that in actual devices, large > small, high > low, and bright > dark can be reversed when only comparing numerical values? Some companies may not be aware that they are not obtaining images with the resolution they imagined from the X-ray equipment they are currently using. This document thoroughly explains the necessary points for appropriate equipment selection from various perspectives! We provide all the comparative data of two products with different tube currents using the JIMA test chart. ★ You can view the table of contents from the "PDF Download." If you would like the complete version, please apply through "Contact Us." [Content (excerpt)] ■ Differences between catalog specifications and actual image resolution ■ How X-rays are generated ■ Differences between geometric magnification and monitor magnification ■ The impact of X-rays on semiconductor components * Additionally, we offer verification using actual devices that clearly shows the differences in resolution. About 80% of the companies that conducted the tests have made purchases! If you're interested, please feel free to contact us.

  • X-ray inspection equipment

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3D stereo inline X-ray inspection device ILX-1100/2000

3D stereo inline X-ray inspection device ILX-1100/2000

The cost reduction of inline automatic inspection has been achieved through the 3D X-ray stereo method!

This product is an inline inspection device that automatically inspects the solder joints of mounted circuit boards using X-rays. In high-density circuit boards, the solder joints are located on the bottom surface of the components (face down), making visual inspection impossible. It is suitable for inspecting components like QFN/SON, where the solder joints are on the bottom surface of the components. 【Features】 - Safe design, no qualifications required for handling X-rays - Compact and space-saving, enabling inline X-ray inspection - Can inspect without being affected by the backside of double-sided mounted circuit boards - Capable of 3D tomographic inspection using X-ray stereo method - Supports small circuit boards (50×50mm) to large sizes (510×460mm) - Capable of inspecting bottom-soldered components like BGA using X-ray stereo method *For more details, please refer to the PDF materials or feel free to contact us.

  • Other semiconductor manufacturing equipment

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3D X-ray inspection device 'FX-400tRX with CT'

3D X-ray inspection device 'FX-400tRX with CT'

X-ray stereo method! The resolution has improved threefold from the conventional 100-layer cross-section to a 300-layer cross-section.

This product is an X-ray inspection device that can slice a printed circuit board from the top surface to the bottom surface into 300 layers using X-ray stereo technology (our proprietary technology). The resolution has increased threefold from the conventional 100-layer cross-section to a 300-layer cross-section. The X-ray output is 110kV, 200μA, with a resolution of 2μm. It comes standard with a chip counter function and allows selection from three types of CT methods. 【Features】 ■ X-ray stereo technology (our proprietary technology) ■ Slices the printed circuit board from the top surface to the bottom surface into 300 layers ■ Resolution improved threefold from the conventional 100-layer cross-section to a 300-layer cross-section ■ X-ray output of 110kV, 200μA, with a resolution of 2μm ■ Three types of CT methods (V-CT, diagonal CT, stereo CT) *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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"FX-300tRX2 with CT" chip counter function

"FX-300tRX2 with CT" chip counter function

This is an introduction to the standard-equipped chip counter function of the X-ray stereo 3D X-ray inspection device.

This product is an X-ray inspection device newly equipped with a chip counter function. The chip counter function counts the number of electronic components within embossed tape wound on a reel by using X-ray transmission images. The tape reel can be set in the device as it is, and by pressing the count button, the quantity of "components in the reel" is counted in about 30 seconds. The counted quantity is linked to a barcode and output as a CSV file. 【Features】 ■ Can accommodate tape reels with a diameter of up to 250mm ■ Chip counting possible in about 30 seconds per reel ■ Barcode compatible, CSV output compatible (BC reader not included) ■ Capable of counting chips of size C0402 *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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IC wire bond / lead frame automatic inspection device LFX-1000

IC wire bond / lead frame automatic inspection device LFX-1000

Automatic inspection of IC wire bonds and lead frame conditions! Inline X-ray inspection equipment.

The "LFX-1000" is an inline X-ray inspection device capable of fully automated inspection using a reflective type. It inspects the state of wire bonds and lead frames inside ICs with high speed and high precision. In addition, we also handle the transmission type "LFX-2000," as well as the reflective type automatic inspection device for reel-compatible IC wire bonds, "LFX-1000R," and the transmission type "LFX-2000R." 【Features】 ■ Automatically transports and inspects in the state of the lead frame, marking defective areas. ■ Capable of inspecting not only wire bonds but also metal foreign objects and lead frame pitch. ■ Lead frames can be set directly in the loader section or supplied via a magazine rack. *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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[Exhibition Participation] High-Resolution Offline X-Ray Inspection Equipment

[Exhibition Participation] High-Resolution Offline X-Ray Inspection Equipment

We will hold an exhibition in Okayama for two days on November 21-22. We will showcase the offline X-ray inspection device: FX-400tRX.

We will be exhibiting our 【X-ray inspection equipment】 at the "MUSUBI Okayama Exhibition" to be held from November 21 (Tuesday) to November 22 (Wednesday). ■ Equipment exhibited by Aibit: Offline X-ray Inspection System: FX-400tRX - Surface and back surface cancellation of the mounted circuit board using X-ray stereo method (approximately 4-5 seconds) - Acquisition of 300 layers of horizontal cross-section of the mounted circuit board using X-ray stereo CT method - High-output X-ray source with 110kV, 200µA - Acquisition of fine images with a high resolution of 2μm - Automatic inspection using CT function (OK/NG judgment) In addition to the equipment being exhibited this time, we have various other devices tailored to customer applications. Please feel free to contact us. 【Demonstration on the day】 Sample imaging can be performed using your samples. Please contact us in advance with your preferred date and time, as well as sample details. If you wish to have a demonstration at the venue, please let us know. *Please note that if there is no prior contact, it may not be possible to conduct imaging on the day according to the schedule. 【Exhibition Overview】 Period: November 21 (Tuesday) to November 22 (Wednesday) Venue: Okayama "Convex Okayama Small Exhibition Hall" For more details, please contact us.

  • X-ray inspection equipment

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X-ray wafer bump automatic inspection system 'Six-3000'

X-ray wafer bump automatic inspection system 'Six-3000'

Transmitting X-rays to the voids inside the wafer! Automatically inspecting the quality of voids above the reference value.

The "Six-3000" is an automatic X-ray inspection device that inspects and determines bumps on wafers. It uses X-rays to penetrate voids inside the wafer and calculates the diameter (area) of the voids from the transmitted images, automatically determining the quality of voids exceeding the reference value. A micro-focus X-ray tube is used as the X-ray source, and an X-ray digital camera is employed for the X-ray detection part, allowing for the extraction of high-resolution images. This enables high-precision void inspection. Additionally, we also offer the silicon wafer crystal defect void inspection device "X-CAS-2." 【Features of Six-3000】 ■ An automatic X-ray inspection device that inspects and determines bumps on wafers ■ Uses X-rays to penetrate voids (bubbles) inside the wafer ■ Automatically determines the quality of voids exceeding the reference value ■ Uses a micro-focus X-ray tube as the X-ray source ■ Employs an X-ray digital camera for the detection part, extracting high-resolution images *For more details, please refer to the PDF materials or feel free to contact us.

  • X-ray inspection equipment

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IC wire bonding X-ray inspection device 'LFX-1000R'

IC wire bonding X-ray inspection device 'LFX-1000R'

This is an introduction to a device that uses X-rays to perform radiographic inspection of the internal condition of reel-shaped IC components.

The IC wire bonding X-ray inspection device "LFX-1000R" is a device that uses X-rays to perform radiographic inspection of the internal condition of reel-type IC components. While winding the ICs from the tape reel, it automatically inspects the connection status of the wire bonding for each individual IC (Good/NG judgment). The compatible reel dimensions range from 180 to 380 mm. 【Features】 ■ Compatible reel dimensions: 180 to 380 mm ■ Radiographic inspection of the internal condition of IC components using X-rays ■ Automatic inspection of the connection status of wire bonding for each individual IC ■ A lead frame compatible type "LFX-1000" is also available *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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IC wire bond/lead frame automatic inspection device LFX-1000

IC wire bond/lead frame automatic inspection device LFX-1000

It is an inline X-ray inspection device that automatically inspects the IC wire bond and lead frame condition.

This product is an inline X-ray inspection device capable of fully automated inspection, which inspects the condition of wire bonds and lead frames inside ICs with high speed and high precision. It automatically conveys and inspects the lead frame condition, marking any defective areas. In addition to inspecting wire bonds, it can also inspect for metal foreign objects and lead frame pitch. It can be connected to various types of loaders and unloaders. 【Features】 - Automatic conveyance and inspection in the lead frame condition - Capable of inspecting for metal foreign objects and lead frame pitch - Can be connected to various types of loaders and unloaders - Lead frames can be set directly onto the loader or supplied via a magazine rack *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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[Company Overview] The Lineage of Ibit Corporation

[Company Overview] The Lineage of Ibit Corporation

Awards for technological development! Our company has been involved in the development, clarification, and release of various devices.

Our company has been involved in the development, clarification, and release of various devices. For example, we developed a 12,000,000 pixel camera (4,000x3,000) for high-speed inspection of 300mm wafers and clarified the mechanism of vacuum soldering. We also have a history of receiving awards for technological development and being recognized as an excellent company. [Career Highlights (Excerpt)] ■2003: Introduced "Hydrogen/Vacuum/Heating Furnace" into X-ray equipment Clarified the mechanism of vacuum soldering ■2004: Developed a 12,000,000 pixel camera (4,000x3,000) for high-speed inspection of 300mm wafers ■2005: Merged X-ray equipment with die bonders, integrating chip mounting functions ■2006: Developed a fully automated inspection machine for crystal defect voids in Si wafers *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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Invitation to the Opening of the Ivy Bit Osaka Demo Room

Invitation to the Opening of the Ivy Bit Osaka Demo Room

You can experience "backside cancellation," which allows for accurate X-ray inspection of the circuit board by removing the components implemented on the backside. Verification and experimentation of the circuit board can be conducted with equipment from seven companies.

Aibit has opened a demonstration room called "MUSUBI Osaka Labo" in Shin-Osaka, where equipment from seven companies related to semiconductor manufacturing is gathered. It is also possible to validate and experiment with substrates using our X-ray inspection equipment, and you can experience how our unique "X-ray stereo method" resolves the difficulty of inspecting substrates that overlap and are hard to see in just 4 seconds. 【Demonstration Room Overview】 Location: 1-7-27 Nishinomiya-hara, Yodogawa-ku, Osaka City, Osaka Prefecture Business Hours: Weekdays 9:00 AM to 5:00 PM (About a 10-minute walk from JR Shin-Osaka Station) *For more details, please refer to the materials. Feel free to contact us as well.

  • others

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3D stereo inline X-ray inspection device ILX1000/2000

3D stereo inline X-ray inspection device ILX1000/2000

Inspection is possible only on the surface of the double-sided implementation substrate! Also compatible with 3D tomography inspection. *Detailed explanatory materials will be provided.

The "ILX-1000/2000" is an inline X-ray inspection device that automatically inspects the soldering areas of mounted circuit boards. Thanks to our unique inspection method, it supports separate inspections of the front and back surfaces of the circuit board. It is not affected by the back side of double-sided mounted boards. Additionally, 3D tomography inspection is also possible. It is suitable for inspecting soldering areas of BGA/CSP components and components like QFN/SON that have soldering on the bottom surface. 【Features】 ■ Capable of inspecting bottom-soldered components such as BGA ■ Can cancel out components on the back side of the board for inspection ■ Supports small boards (50×50mm) to large sizes (510×460mm) ■ Compact and space-saving, suitable for inline use *We are currently offering detailed materials that explain the product. Please refer to those for more information.

  • Semiconductor inspection/test equipment
  • X-ray inspection equipment

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Silicon wafer crystal defect void inspection device 'X-CAS-2'

Silicon wafer crystal defect void inspection device 'X-CAS-2'

Automatically inspect crystal defect voids inside silicon wafers!

The "X-CAS-2" from iBit is a device that automatically inspects voids, which are crystal defects inside silicon wafers, using X-rays. By adopting an X-ray inspection method, it is possible to conduct inspections regardless of the wafer's resistance value and even in the state before polishing (immediately after slicing). The sizes of the silicon wafers to be inspected are 12 inches and 8 inches, with an option to add 6 inches. 【Features】 - Automatically inspects voids inside silicon wafers - Inspections can be performed regardless of the wafer's resistance value - Inspections can be conducted even in the state before polishing - Inspections are applicable for 12-inch, 8-inch, and optionally 6-inch silicon wafers *For more details, please refer to the catalog or feel free to contact us.

  • Semiconductor inspection/test equipment
  • X-ray inspection equipment

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Announcement of the seminar "Analysis Methods for Defective Substrates Using X-ray Equipment"

Announcement of the seminar "Analysis Methods for Defective Substrates Using X-ray Equipment"

Seminar held at the Implementation and Assembly Process Technology Exhibition 2024 in Kumamoto! We will introduce methods for defect analysis using X-rays and methods for identifying the causes of defects.

At the exhibition "Assembly and Mounting Process Technology Exhibition 2024 in Kumamoto," organized by 19 manufacturers of mounting equipment and post-mounting process manufacturers, we will hold a free seminar on "Analysis Methods for Defective Boards Using X-ray Equipment." In this seminar, we will introduce X-ray inspection methods, analysis methods for defects using X-rays, and ways to identify the causes of defects. We will also cover defect cases such as "defects caused by bubbles in inner layer vias" and "defects caused by cracks in board through-holes." We look forward to your attendance. 【Event Overview】 ■ Date and Time - November 28, 2024 (Thursday) 15:00 - 16:00 - November 29, 2024 (Friday) 10:15 - 11:15 ■ Venue: Gran Messe Kumamoto Conference Room ■ Address: 1010 Fukutomi, Mashiki Town, Kamimashiki District, Kumamoto Prefecture ■ Participation Fee: Free *For more details, please download the PDF or feel free to contact us.

  • X-ray inspection equipment

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Invitation to the exhibition "Implementation and Assembly Process Technology Exhibition"

Invitation to the exhibition "Implementation and Assembly Process Technology Exhibition"

We plan to release a number of X-ray inspection devices (offline inspection devices, inline assembly inspection devices, reel-compatible inspection, etc.)!

Aibit Co., Ltd. will be exhibiting at the "Implementation and Assembly Process Technology Exhibition" held at Haibu Nagaoka (Niigata). At this exhibition, you will be able to see new equipment from various manufacturers that continue to support quality improvement and productivity enhancement in production sites. We plan to showcase a 3D X-ray observation device, a 3D X-ray stereo method observation device, and a 3D X-ray stereo method inline X-ray inspection device. 【Event Overview】 ■ Date: April 24 (Thursday) to April 25 (Friday), 2025 ■ Time: 10:00 AM to 5:00 PM (Last admission at 4:00 PM) ■ Admission Fee: Free ■ Venue: Haibu Nagaoka, 1st Floor Full Hall *For more details, please download the PDF or feel free to contact us.

  • X-ray inspection equipment

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